TSSOP10 to DIP
ADAPTER with proto area

TSSOP10 TO DIP CONVERTER ADAPTER WITH GROUND AND DECOUPLING

- SMD / SMT packages: TSSOP10
- Adapter board converting to DIP connector. Intended for breadboard testing and prototyping.
- PCB has a solder mask layer to minimise the formation of solder bridges during soldering.
- For connectors with a 0.1-inch pitch, not included.
- Bottom copper with pads for SMD prototyping. The pads are interconnected with tracks, easy to remove as required.

Example of TSSOP10 package

PCB board dimensions: 14 x 14 x 1.5 mm
Connections: 2X Single row 2.54 mm pitch of holes for inserting header pins, (not included).
Distance between rows: 10.1 mm
Board type: FR4 Copper Clad Laminate 35um
Surface: Immersion Nickel Gold
Holes: Plated Through Holes: 1 mm Ø
External connectors: 2.54 mm pitch
RoHS conform: yes

Home

Shop